WayLink Systems Corporation

WayLink Systems CorporationWayLink Systems CorporationWayLink Systems Corporation

WayLink Systems Corporation

WayLink Systems CorporationWayLink Systems CorporationWayLink Systems Corporation
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World Leader in Fully Automated Pavement Survey in Sub-MM 3D

World Leader in Fully Automated Pavement Survey in Sub-MM 3DWorld Leader in Fully Automated Pavement Survey in Sub-MM 3DWorld Leader in Fully Automated Pavement Survey in Sub-MM 3D

We make Deep-Learning based technology accessible!

World Leader in Fully Automated Pavement Survey in Sub-MM 3D

World Leader in Fully Automated Pavement Survey in Sub-MM 3DWorld Leader in Fully Automated Pavement Survey in Sub-MM 3DWorld Leader in Fully Automated Pavement Survey in Sub-MM 3D

We make Deep-Learning based technology accessible!

Who We Are

WayLink Systems Corporation is a U.S. based technology company specializing in automated pavement (highway, roadway, and airfield) data collection and analysis. WayLink's Pave3D 8K technology suite harmoniously integrates leading-edge sub-mm 3D laser imaging hardware, Deep-Learning based software, and decades of combined expertise of its senior staff to serve multitude of clients worldwide. Its technical strengths rooted in several US based research universities.


Its flagship technology CrackNet is the first production-worthy AI based solution for fully automated survey of cracking and other distresses. The new Pave3D 8K laser imaging system provides 0.5-mm resolution in the transverse direction, and 30KHz 3D line rate in the longitudinal direction. We proudly serve clients in the US, Brazil, South Africa, China, and Japan.

Pave3D 8K & CrackNet in Action

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